Packaging of photonic devices can account for over 50% of the manufacturing costs of a photonic product. Therefore, it is vital that anyone developing photonic based products have an understanding of the materials, technologies and processes required to package their photonic devices.

This three-day training course provides attendees, especially those involved in developing prototypes based on Photonic Integrated Circuits (PICs), with the fundamental technical skills in package design, assembly and reliability analysis.

The course covers key aspects of the optical, electrical, thermal and mechanical processes of packaging technologies using our standard photonic package designs, which are offered through Europractice.

At the end of the course attendees should be able to

• Perform key photonic packaging processes and use advanced packaging equipment

• Understand photonic module reliability and failure analysis

• Aware of critical photonic packaging design rules

Participants will learn the basics of creating a standard package, with detailed consideration given to each process step—from initial design to packaging a prototype. The course also covers the critical area of reliability testing and includes a mix of lectures and practical hands-on activities.

Course contents

• Introduction, orientation and Overview of Europractice and PIXEurope

• Optical Packaging (Hands-on practical session)

• Electrical Packaging (Hands-on practical session)

• Microtransfer Printing (Lecture)

• Mechanical design (Lecture)

• Reliability (Lecture & Lab Tour)

• Q&A and conclusion

This course is co-organised by Europractice and PIXEurope.