NorFab - The Norwegian infrastructure for micro- and nanofabrication
NorFab is an open-access infrastructure for micro- and nanofabrication that supports everything from basic research to small-scale production. The infrastructure has four nodes in Trondheim (NTNU NanoLab), Oslo (UiO and SINTEF MiNaLab) and Horten (USN MST-Lab).
NorFab supports education, research and innovation, with both flexible infrastructure for the development of new technology, as well as complete process lines for small-scale production of sensor chips.
European chips design platform
The European Chips Design Platform (EuroCDP) is designed to support startups, SMEs and researchers with streamlined access to all the necessary tools and competency to design and launch semiconductor technologies. This includes design tools, IP, expert support, prototyping, fabrication, packaging, testing, training, funding and dedicated startup programs.
EuroCDP serves as a one-stop platform for semiconductor design, helping users to more quickly develop a concept into functional technologies.
NanoIC pilot line
Pilot line co-funded by Chips JU, coordinated by Imec, to develop system-on-chip based on beyond-2nm logic nodes. The pilot line offers low-threshold access to state-of-the-art equipment, as well as advanced research and development in new materials, processes and modules.
NanoIC offers various technologies, including:
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Advanced logic technologies (N2 and A7 nodes)
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Advanced memory technologies (SOT-MRAM and eDRAM)
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Advanced interconnect technologies
FAMES pilot line
Pilot line co-funded by Chips JU, coordinated by CEA-Leti, which will develop FD-SOI technology on 10nm and 7nm nodes, combined with non-volatile memories (NVM), RF components and smart PMIC (power management for integrated systems).
FAMES offers various technologies, including:
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FD-SOI on 10nm and 7nm technology nodes
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Different types of NVM (OxRAM, FeRAM, MRAM and FeFETs)
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RF components (switches, filters and capacitors)
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3D integration (heterogeneous and sequential)
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Power management integrated circuits (PMIC)
APECS pilot line
Pilot line co-funded by Chips JU, coordinated by Fraunhofer, to develop advanced packaging technology and heterogeneous integration of electronic components and systems. APECS offers innovation in heterogeneous integration based on chiplets, QMI, RF, opto, sensors and passive components.
In addition, APECS offers, among other things:
Design (chiplet building blocks and STCO)
Characterization, test and reliability (CRT platform)
Organic substrate and panel-level packaging
Wafer-level packaging
WBG pilot line
Pilot line co-funded by Chips JU, coordinated by CNR, to develop wide bandgap semiconductor technologies for power- and RF electronics. The WBG pilot line focuses on wide bandgap semiconductors, in particular SiC and GaN.
The WBG's technology catalog includes:
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Power transistors
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High frequency/high voltage components (HEMT, MISHEMT, FinFET, PND, etc.)
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Access to WBG materials (SiC, GaN, AlN, Ga2O3)
PIX Europe pilot line
Pilot line co-funded by Chips JU, coordinated by ICFO, which will accelerate the development of photonic integrated circuits (PIC), essential components for high-speed computing, communication and quantum information systems.
PIX Europe offers various technologies, including:
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Monolithic chip fabrication and integration processes with new materials
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Advanced wafer-level packaging processes
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High-throughput processes for testing and reliability analysis
Pilot lines for quantum chips
Chips JU has decided to fund six pilot lines for the development of quantum chips. Five of the pilot lines are so-called stability pilots based on i ) superconductors, ii ) photonics, iii ) semiconductors, iv ) diamond-based and v ) neutral atoms. In addition, a trapped ion pilot line will be established. More information about these will follow.